Design considerations for FR1 PCB

5 min read
26 December 2022

There are several applications that call for high temperature performance, including those, for a circuit board made from FR-1 material. The thermal coefficient of expansion (TCE), surface mount technology, and the contribution of the laminate to the board are a few design factors and difficulties to be aware of.

Temperature coefficient of expansion

The rate at which PCB material expands when heated is known as the coefficient of thermal expansion, or CTE. The number typically ranges from 10 to 20 parts per million. The tracks may become damaged if the PCB material expands more quickly than the copper. Failure may occur as a result of mechanical stress and fissures caused by this.

Almost all electronic gadgets contain printed circuit boards. They offer a practical way to connect circuits. They also significantly impact electrical systems, though. The characteristics of the PCB can have a big impact on high power applications. Therefore, it's crucial to select the proper PCB materials to satisfy your requirements.

The most common material for printed circuit boards is FR4. It is a typical substance in the sector. However, there are additional materials that can improve your PCB's performance.

Design considerations for FR1 PCB

The dependability and thermal resistance of FR4 are good. However, before selecting FR4 for your PCB, it's crucial to understand its special characteristics.

Surface-mount engineering

Using surface mount technology, electronic components can be mounted on printed circuit boards. This enables producers to quickly and cheaply make a range of boards. But when manufacturing a FR1 PCB,, surface mount technology has drawbacks and can be problematic.

Using the appropriate technology is crucial for successfully assembling a FR1 PCB. It is necessary to consider both the board's finish and the component's mechanical properties.

A printed circuit board known as a FR1PCB employs a paper laminate with copper on both sides of the laminate. Usually, paper pulp from wood has been bleached. It typically has a 1.6 mm thickness (0.06).

A FR1PCB's capacity for components is constrained because it is created using a single-sided circuit. Additionally, it cannot endure high temperatures. As a result, putting high-wattage components on it is not recommended.

The lower labour costs associated with surface mount technology are one of its main benefits. Furthermore, it raises component density. It also lessens interference coupling.

input from laminates on the circuit board

You're not likely to be shopping for a brand-new set given the size and price of your PCB. Therefore, hiring an electronics expert is the best course of action. Fortunately, there are lots of reliable manufacturers to pick from. The selection procedure should be simple because there is a wealth of expertise available from these businesses. Additionally, they consistently go above and above to gratify their clients. You can be sure that your company is in capable hands whether it's a straightforward circuit board upgrade or a comprehensive custom rework.

Even better, these suppliers will really carry out the exchange in addition to being willing to do so. This offers top-notch, well-lit offices in the centre of your preferred city. The main drawback is that it's unlikely that they'll have a short walk to work. You will undoubtedly get greater value for your money because they may be a little more reasonably priced than their rivals.

Design considerations for FR1 PCB

Particular design factors

To function successfully, printed circuit boards require the appropriate technology. The board needs to use the right materials and take the right design factors into account in order to do this.

Thermal conductivity should be the first factor taken into account while selecting PCB materials. The board's capacity to transport heat from one component to another is known as thermal conductivity. Watts per metre is the standard unit of measurement. The board should be able to withstand temperatures in the range of 0.3 W/Mk to 6 W/Mk for the best thermal conductivity.

The laminate's thickness should be taken into account while selecting FR1 PCB materials. The average FR1 PCB is limited to 1.6 mm in thickness.

The kind of surface mount technology used for the assembly is another factor. More components can fit on the board thanks to surface mount technology. This results in an increase in assembly process efficiency.

There are many PCB design programmes available for FR1 PCB design. These programmes are made to assist users in creating the greatest PCBs possible.

 

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